Page:United States Statutes at Large Volume 111 Part 3.djvu/843

 PROCLAMATION 7011-JUNE 30, 1997 111 STAT. 2931 Annex I (continued) -4- Section B. (con.) (8). Subheadings 8421.19.00 and 8421.91.60 are superseded and the following inserted, in nufflerical sequence, in lieu thereof: CCtntrifugM, Including ctntrtfugal...:] [Ctntr of Annex II J,N X) to this proclamation (9). Subheadings 8424.30.90, 8424.89.90 and 8424.90.90 are superseded and the following Inserted, in numerical sequence, in lieu thereof: (Mechanical appliances (whether or...:] (Stcan or sand blasting...:) • • 8424.30. 40 Deftash nachines for cleaning and removing contaninants from the netal leads of scaiconductor packages prior to thr electroplating process (deflash by projectile beads) Sec section A Free (A,CA,E,IL, 3SX of Annex II J,NX) to this proclamation 8424.3 0.80 Other See section A Free (A.CA.E.IL, 35X" of Annex II J,NX) to this proclamation (Other appliances:) [Other:] • • 8424.89.50 Spraying appliances for developing seiaiconductor wafers; spraying appliances for etching, developing, stripping or cleaning flat panel displays; deflash nachines for cleaning and removing contsitinants frosi the metal leads of semiconductor pscliages prior to the electroplating process (deflash by high pressure spray) See section A Free (A,CA,E,IL, 3SX of Amex II J.NX) to this proclamation 8424.89.70 Other See section A Free (A.I.CA.E, 3SX* of Annex II IL.J.MX) to this proclamation (Parts:) "8424.90.60 Of spraying appliances of subheading 8424.89 for etching, developing, stripping or cleaning semiconductor wafers and flat panel displays See section A Free (A.CA.E.IL, 35X of Annex II J.NX) to this proclamation 8424. 90.80 Other See section A Free (A.S.IM.E, 3iV of Annex II IL.J.MX) to this proclamation

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