Page:United States Statutes at Large Volume 109 Part 2.djvu/342

 109 STAT. 1314 PROCLAMATION 6763—DEC. 23, 1994 Annex ( con.) -26 5- Secti on A. (contin ued) (306). Subheadings 8456.90.10 and 8456.90.50 are superseded by: [Machine tooLs for working any material by...:] [Other:] "For uorlcing metal: 8456.90.20 Focused ion bean milling machines designed to produce or repair masks and reticles of seniconductor device designs Free SOX 8456.90.40 Other (See section Free (A,CA,E,IL, 30% D to this J,NX> Annex] Other: 8456.90.60 Dry etching (including plasma) machines designed to process semiconductor wafers Free 35X 8456.90.80 Other [See section Free (A,CA,E,IL, 35X* 0 to this J,MX) Annex] (307). Subheadings 8464.20.00 and 8464.90.00 are superseded and the following provisions Inserted in numerical sequence: [Machine tools for uorking stone, ceramics,...:] "8464.20 Grinding or polishing machines: 8464.20.10 Machines designed to process semiconductor wafers Free 35X 8464.20.50 Other [See section Free (A,CA,E,IL, 35X D to this J,NX) Annex] 8464.90 Other: 8464.90.10 Machines designed to scribe or score semiconductor wafers into finished chips or die; wet chemical etching machines designed to process semiconductor wafers Free 3SX 8464.90.50 Other [See section Free (A.CA.E,!!.. 35X" D to this J,NX) Annex]

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