Page:Title 3 CFR 2007 Compilation.djvu/184

 Proc. 8214 Title 3--The President (32) 8473.50 Pans and a\275cnssofies equally suitable for use with machines of two or more of hcadings 8469 to 8472 (33) 8486.10.00 Chemical vapor deposition apparatus for s\177niconductOr production (34) 8486.10.00, 8486.20.00 Dicing machine for scn'bing or scoring .\177,emiconductor wafer\177 (35) 8486.10.00, 8486.20.00, Apparatus for wet etching, clrveJoping, stripping or cleaning 8486.30.00, 8486.40.00 semiconductor wafer\177 and flat panel displays (36) 8486.10.00. 8486.20.00 Spin dr\177ers for semiconductor wafer processing ' (37) 8486.l 0.00 Machines for working any material by removal of material, by laser or other light or photo-beam in lhe production of s\177:nJconductor wafas (38) 8486.10.00 Machines for sawing monocryslal seraiconductor boules into slices, or wafe\177 into chips (39) 8486.10.00, 8486.20.00 Grinding, polishing and lapping machines for processing of semiconductor wafers (40) 8486.10.00 Apparatus for growing or pulling rannee .rystal semiconductox bou]es (41) 8486.20.00 Ion implanters designed for doping semiconductor materials (42) 8486.20.00 Apparatus for physical deposition by sputtering on semiconductor wafers (43) 8486.20.00 Epitaxial deposition machines for semiconductor wafers (44) 8486.20.00 Lase\177utlers for cutting contacting tracks in semiconductor production by laser besm (45) 8486.20.00 Machines for di'y,,-\275tching patterns on semiconductor materials (46) 8486.20.00 Apparatus for stripping or cleaning semiconductor wafers (4?) 8486.20.00 Physical deposition apparatus for semiconductor producllon (48) 8486.20.00 Spraying appliances for \177lching, slapping or cleanin 8 semiconductor wafe\177 {49) 8486.20.00 Spinners for coating photographic emulsions on semiconductor warns (50) 8486.20.00 Resistance healed furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafe'm (51 ) 8486.20.00 Inductance or dielectric fumces and ovaas for the manufactnre of s\177ni- conductor devices on semiconductor waf'e'\177 (52) 8486.20.00 Apparatus for the pro. jection, drawing or plating circuit parlerns on .sensitized semiconductor rantertats or fiat panel displays (53) 8486.20.00 Apparatus for rapid heating of semiconductor wafers (S4) 8486.40.00 Focused ion beam milling machines to produce or r\177pail' masks and reticles for patterns on semiconductor din, ices (55) 8486.40.00 Machines for bending, folding and straightening semiconductor leads 184

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