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 LOW COST

–plastic package (15% less than ceramic)

–low power dissipation

–SDB/AIM development system

UNIQUE ARCHITECTURE

–high level of integration

–on-chip RAM, ROM, I/O, Timer

–fewer components required, 1 or 2 chip system

–less support circuitry required

FLEXIBLE

–65K Memory (PROM, ROM, RAM - dynamic or static)

–256 Input/Output ports

–Transparent DMA

–Complete family for 1, 2 or multichip systems

HIGH PERFORMANCE

–N-channel silicon gate

–2 microsecond instruction time

–70 basic instructions